X

Xiaomi's Mi 9 glitters with new rear triple-camera setup

The Chinese phone maker has a new phone to show off just before Mobile World Congress officially begins.

aloysiuslow.jpg
aloysiuslow.jpg
Aloysius Low
xiaomi-m912
1 of 12 Lori Grunin/CNET

The latest phone from Chinese manufacturer Xiaomi is all screen and no notch. There's just a tiny teardrop-shaped hole for its front 20-megapixel camera. It will launch in China before heading out to other markets. 

xiaomi-m91
2 of 12 Lori Grunin/CNET

The Xiaomi Mi 9's rear is protected by Gorilla Glass 5 and shimmers in the light.

xiaomi-m910
3 of 12 Lori Grunin/CNET

The phone uses a Type-C USB port.

xiaomi-m913
4 of 12 Lori Grunin/CNET

It has a 6.39-inch AMOLED display and fits comfortably in my hand.

xiaomi-m916
5 of 12 Lori Grunin/CNET

The phone comes in violet, blue and black. 

xiaomi-m92
6 of 12 Lori Grunin/CNET

The three rear cameras will stick out, so this phone probably won't lay flush on a surface.

xiaomi-m921
7 of 12 Lori Grunin/CNET

And no, there's no audio jack. Just in case you were wondering. 

xiaomi-m922
8 of 12 Lori Grunin/CNET

The rear triple-camera setup includes a 48-megapixel main camera, a 12-megapixel telephoto for 2x zoom and a 16-megapixel ultra-wide angle shooter.

xiaomi-m924
9 of 12 Lori Grunin/CNET

A Special Transparent Edition will also be available, but the cool-looking "innards" is actually an aluminium heatsink.

xiaomi-m93
10 of 12 Lori Grunin/CNET

The new Mi 9 is a sleek, slender beauty. 

xiaomi-m96
11 of 12 Lori Grunin/CNET

The Mi 9's rear dazzles in the right light.

xiaomi-m98
12 of 12 Lori Grunin/CNET

While the phone doesn't have an audio jack, it will mostly likely come with a USB-C-to-3.5mm audio out adapter. 

More Galleries

Go Inside the Apple iPhone 15 and iPhone 15 Pro: See How the New iPhones Look and Work
iphone 15 in different color from an angled view

Go Inside the Apple iPhone 15 and iPhone 15 Pro: See How the New iPhones Look and Work

21 Photos
17 Hidden iOS 17 Features and Settings on Your iPhone
Invitation for the Apple September iPhone 15 event

17 Hidden iOS 17 Features and Settings on Your iPhone

18 Photos
Astronomy Photographer of the Year Winners Reveal Our Stunning Universe
andromeda

Astronomy Photographer of the Year Winners Reveal Our Stunning Universe

16 Photos
I Got an Early Look at Intel's Glass Packaging Tech for Faster Chips
Rahul Manepalli, right, Intel's module engineering leader, shows a glass substrate panel before it's sliced into the small rectangles that will be bonded to the undersides of hundreds of test processors. The technology, shown here at Intel's CH8 facility in Chandler, Arizona, stands to improve performance and power consumption of advanced processors arriving later this decade. Glass substrates should permit physically larger processors comprised of several small "chiplets" for AI and data center work, but Intel expects they'll trickle down to PCs, too.

I Got an Early Look at Intel's Glass Packaging Tech for Faster Chips

20 Photos
Check Out the iPhone 15's New Camera in Action
A photo of a silhouette of buildings on the water taken on the iPhone 15

Check Out the iPhone 15's New Camera in Action

12 Photos
Yamaha motorcycle and instrument designers trade jobs (pictures)
yamaha01.jpg

Yamaha motorcycle and instrument designers trade jobs (pictures)

16 Photos
CNET's 'Day of the Dead Devices' altar (pictures)
dia-de-los-muertos-3318-001.jpg

CNET's 'Day of the Dead Devices' altar (pictures)

9 Photos