X

Photos: Pantech Slate

The Pantech Slate is the world's thinnest messaging phone, and features include a 1.3-megapixel camera, Bluetooth, and messaging. It doesn't have 3G, however.

CNET Reviews staff
See full bio
CNET Reviews staff
33370235-2-440-FT.jpg
1 of 7 Corinne Schulze/CNET

Pantech Slate

The Pantech Slate lives up to its name with its super-slim form factor.
33370235-2-440-SD.jpg
2 of 7 Corinne Schulze/CNET

Skinny

The Pantech Slate is only around 0.38 inch thick, making it the thinnest messaging phone around.
33370235-2-440-DT1.jpg
3 of 7 Corinne Schulze/CNET

Megapixel camera

The Pantech Slate has a 1.3-megapixel camera on the back, but no self-portrait mirror.
33370235-2-440-DT2.jpg
4 of 7 Corinne Schulze/CNET

Roomy keyboard

The Pantech Slate has a spacious keyboard with keys that are raised above the surface.
33370235-2-440-PALM.jpg
5 of 7 Corinne Schulze/CNET

Nice feel in the hand

The Pantech Slate has a textured back that's good for extra grip and a more secure feel in the hand.
33370235-2-440-BUTTON.jpg
6 of 7 Corinne Schulze/CNET

Conducive to texting

The Pantech Slate has a roomy keyboard that's very conducive to typing out quick text messages.
33370235-2-440-POCKET.jpg
7 of 7 Corinne Schulze/CNET

Pocket friendly

The Pantech Slate is thin enough to be slipped into the front pocket.

More Galleries

Go Inside the Apple iPhone 15 and iPhone 15 Pro: See How the New iPhones Look and Work
iphone 15 in different color from an angled view

Go Inside the Apple iPhone 15 and iPhone 15 Pro: See How the New iPhones Look and Work

21 Photos
17 Hidden iOS 17 Features and Settings on Your iPhone
Invitation for the Apple September iPhone 15 event

17 Hidden iOS 17 Features and Settings on Your iPhone

18 Photos
Astronomy Photographer of the Year Winners Reveal Our Stunning Universe
andromeda

Astronomy Photographer of the Year Winners Reveal Our Stunning Universe

16 Photos
I Got an Early Look at Intel's Glass Packaging Tech for Faster Chips
Rahul Manepalli, right, Intel's module engineering leader, shows a glass substrate panel before it's sliced into the small rectangles that will be bonded to the undersides of hundreds of test processors. The technology, shown here at Intel's CH8 facility in Chandler, Arizona, stands to improve performance and power consumption of advanced processors arriving later this decade. Glass substrates should permit physically larger processors comprised of several small "chiplets" for AI and data center work, but Intel expects they'll trickle down to PCs, too.

I Got an Early Look at Intel's Glass Packaging Tech for Faster Chips

20 Photos
Check Out the iPhone 15's New Camera in Action
A photo of a silhouette of buildings on the water taken on the iPhone 15

Check Out the iPhone 15's New Camera in Action

12 Photos
Yamaha motorcycle and instrument designers trade jobs (pictures)
yamaha01.jpg

Yamaha motorcycle and instrument designers trade jobs (pictures)

16 Photos
CNET's 'Day of the Dead Devices' altar (pictures)
dia-de-los-muertos-3318-001.jpg

CNET's 'Day of the Dead Devices' altar (pictures)

9 Photos