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Elpida delays plant

Because of the downturn in semiconductor sales, Elpida Memory will postpone opening a plant for producing 300-millimeter silicon wafers. While construction on the company's Hiroshima plant will continue, equipment installation will be delayed from December 2001 to September 2002, the company announced. The 300-millimeter wafers, compared with today's 200-millimeter wafers, allow semiconductor makers to produce more chips for less. The first 300-millimeter production plants are expected to come online next year. Elpida was established in December 1999 as a joint venture between memory company between NEC and Hitachi.

Because of the downturn in semiconductor sales, Elpida Memory will postpone opening a plant for producing 300-millimeter silicon wafers. While construction on the company's Hiroshima plant will continue, equipment installation will be delayed from December 2001 to September 2002, the company announced. The 300-millimeter wafers, compared with today's 200-millimeter wafers, allow semiconductor makers to produce more chips for less. The first 300-millimeter production plants are expected to come online next year. Elpida was established in December 1999 as a joint venture between memory company between NEC and Hitachi.