Lamina Ceramics said Monday that it has raised $12 million in its first round of funding. Morgenthaler and venture capital firm and research lab Sarnoff, a major communications gear maker, participated in the round. Lamina specializes in making chips for telecommunications equipment that enable the bonding of ceramic and metal materials within the chips, a technology originally developed at Sarnoff. Lamina says this bonded ceramic-on-metal design helps prevent a chip from generating excess heat, a problem that can impede performance and becomes more common as chips consume more power and operate at higher speeds. Lamina expects to have a new manufacturing facility in Westampton, N.J., ready for full production by mid-2002.