Intel fights back with power-sipping Lakefield chip for weird new PCs
Intel's innovative Foveros chip-stacking technology will debut in unusual new laptops with dual screens.
Stephen Shanklandprincipal writer
Stephen Shankland has been a reporter at CNET since 1998 and writes about processors, digital photography, AI, quantum computing, computer science, materials science, supercomputers, drones, browsers, 3D printing, USB, and new computing technology in general. He has a soft spot in his heart for standards groups and I/O interfaces. His first big scoop was about radioactive cat poop.
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is stealing a page from the mobile industry's playbook, developing a new processor code-named Lakefield that breaks new ground when it comes to squeezing significant performance into a tiny package.
Lakefield uses a new Intel technology called Foveros that lets the company stack different chip parts onto different layers. That lets Intel build a chip that's getting closer to the size of those in
-- 12x12mm for Lakefield. That area of 144 square millimeters is larger than
A12 processor at 83 square millimeters, but it's small enough to permit significantly smaller circuit boards -- in part because since it includes its own memory that no longer takes up separate space.
"The board area of Lakefield is less than half of other boards we have done," said Sanjeev Khushu, vice president of Intel's Infrastructure and Platform Solutions Group, who spoke at the Hot Chips conference Tuesday on the Stanford University Campus.
"I see Lakefield as Intel's answer to Qualcomm's... all-day PCs," said Insight64 analyst Nathan Brookwood.
Intel has struggled in recent years as the chip industry smartphones became the premium market that attracted top engineers, the latest manufacturing processes and the fastest growth. Intel's years-long effort to power smartphones flopped. In addition, it's had difficulty advancing to new manufacturing technologies that shrink chips two smaller sizes and let designers add new features.
Lakefield represents a new competitive answer for Intel -- though it's intended for ultrathin PCs, not phones. Intel has been showing off some unusual new designs, several with dual displays, it hopes Lakefield will power.
"The innovative multi-chip stacking can enable new form factors," Brookwood said.
Hybrid design with big and little cores
Lakefield chips adopt a hybrid approach long championed by one of Intel's biggest rivals, Arm, whose chip designs dominate mobile phones today. Specifically, Lakefield combines a single powerful processor core with a host of smaller, more powerful power efficient cores. Arm calls this "big.little," but Khushu tried to position Lakefield as "big.big."
Although Intel has struggled, Lakefield spotlights a source of power for Intel: packaging. Intel has a lot of different ways to attach chip components together and send data among them. That offers flexibility for making chips suited to different tasks.
Mix and match
Foveros enables a mix-and-match approach. Intel can combine high-performance cores built with the latest manufacturing technology with other components already optimized for older manufacturing processes. That helps Intel get more use out of work it's already done.
Intel is testing Lakefield prototypes now, Khushu said, holding up one of them for an elite audience of hundreds of Silicon Valley's top chip designers and executives.
"It's in the final phases of getting ready for production," Khushu said. Production samples should arrive at the end of 2019. "The product is real."
And sequels are planned. Lakefield is the first of a family, he said. The more powerful processor core is built with Intel's most advanced manufacturing process, one that uses 10 nanometer circuitry features, but Intel will bring Lakefield-style chips to modernized 7nm processes and beyond, he said.
First published August 20.
Update, August 21: Adds further detail from Intel. Correction, August 21: The Intel speaker was Sanjeev Khushu, vice president of Intel's Infrastructure and Platform Solutions Group.