X

HitCase turns an iPhone into an action camera (pictures)

The HitCase for iPhone 4/4S turns an iPhone into an action camera, giving it water and shock protection.

Wayne_Cunningham.jpg
Wayne_Cunningham.jpg
Wayne Cunningham
35636374_01.jpg
1 of 7 Josh Miller/CNET
The HitCase is a waterproof, shockproof case designed to fit an iPhone 4/4S and make it usable as an action camera.
35636374_02.jpg
2 of 7 Josh Miller/CNET
A lens port gives the iPhone an unobstructed view for recording video.
35636374_03.jpg
3 of 7 Josh Miller/CNET
The HitCase hinges open, and has three flaps that clamp down to lock the case closed.
35636374_04.jpg
4 of 7 Josh Miller/CNET
The transparent cover allows operation of the touch screen.
35636374_08.jpg
5 of 7 Wayne Cunningham/CNET
HitCase also offers a free video app, called Vidometer, which overlays telemetry data on the image.
35636374_05.jpg
6 of 7 Josh Miller/CNET
The optional SuckR mount locks the HitCase firmly to a car's fender.
35636374_07_2.jpg
7 of 7 Josh Miller/CNET
The mounting bracket lets the HitCase slide and lock into place.

More Galleries

Go Inside the Apple iPhone 15 and iPhone 15 Pro: See How the New iPhones Look and Work
iphone 15 in different color from an angled view

Go Inside the Apple iPhone 15 and iPhone 15 Pro: See How the New iPhones Look and Work

21 Photos
17 Hidden iOS 17 Features and Settings on Your iPhone
Invitation for the Apple September iPhone 15 event

17 Hidden iOS 17 Features and Settings on Your iPhone

18 Photos
Astronomy Photographer of the Year Winners Reveal Our Stunning Universe
andromeda

Astronomy Photographer of the Year Winners Reveal Our Stunning Universe

16 Photos
Check Out the iPhone 15's New Camera in Action
A photo of a silhouette of buildings on the water taken on the iPhone 15

Check Out the iPhone 15's New Camera in Action

12 Photos
I Got an Early Look at Intel's Glass Packaging Tech for Faster Chips
Rahul Manepalli, right, Intel's module engineering leader, shows a glass substrate panel before it's sliced into the small rectangles that will be bonded to the undersides of hundreds of test processors. The technology, shown here at Intel's CH8 facility in Chandler, Arizona, stands to improve performance and power consumption of advanced processors arriving later this decade. Glass substrates should permit physically larger processors comprised of several small "chiplets" for AI and data center work, but Intel expects they'll trickle down to PCs, too.

I Got an Early Look at Intel's Glass Packaging Tech for Faster Chips

20 Photos
Yamaha motorcycle and instrument designers trade jobs (pictures)
yamaha01.jpg

Yamaha motorcycle and instrument designers trade jobs (pictures)

16 Photos
CNET's 'Day of the Dead Devices' altar (pictures)
dia-de-los-muertos-3318-001.jpg

CNET's 'Day of the Dead Devices' altar (pictures)

9 Photos