The multichip package measures only 1.4-millimeters high but can hold a variety of chips, including NAND flash (for storing data), NOR flash (for storing code), and other types of memory. Current Toshiba packages can hold up to six stacked chips.
Designing--those plastic and metal sleeves that you see when you crack open a PC or cell phone--has become increasingly important in the past few years as components and the devices that contain them have shrunk. The package controls the flow of electricity to and from a processor and keeps it attached to a circuit board.
Last year, Intel announced that it would start producingfor phones that could hold up to 1 gigabit (or four chips) in the first quarter of this year. Both Intel and Toshiba have to shave the back of their chips to keep the height on the package low.
Tessera, a small company specializing in packages,in November at $13 a share. Shares now trade above $19. Toshiba is a licensee of Tessera's technology, but said it developed the nine-chip package on its own.