Infineon finishes plant construction
Infineon Technologies has completed construction on a fabrication plant in Dresden, Germany, that will allow the chipmaker to use larger 300-millimeter silicon wafers. The company said it will soon begin to install production equipment in the building. The larger wafers will allow Infineon to significantly cut the cost of producing memory chips, because 2.25 times as many chips can be cut from each wafer. Memory chips will begin to emerge from the factory in late 2002.
Infineon Technologies has completed construction on a fabrication plant in Dresden, Germany, that will allow the chipmaker to use larger 300-millimeter silicon wafers. The company said it will soon begin to install production equipment in the building.
The larger wafers will allow Infineon to significantly cut the cost of producing memory chips, because 2.25 times as many chips can be cut from each wafer. Memory chips will begin to emerge from the factory in late 2002.