Intel announced shipments of the first 3G chips--and future 4G silicon--that sport its branding today at Mobile World Congress--the fruits of its .
"Intel Inside" takes on a new meaning with 3G chips. After the acquisition, Intel Mobile Communications has overnight become a major supplier of so-called baseband processors, which handle the 3G connection and are one of the most critical chips in a smartphone or tablet.
Intel's--formerly Infineon's--3G chips are used in prominent devices such as the iPhone and iPad.
Announced today, the XMM 6260 is designed for smartphones and can be coupled with a smartphone's application processor or offered as a standalone solution for PC modems and data cards, Intel said.
The HSPA+ technology "comprises a fully integrated HSPA+ system solution supporting HSPA category 14 (21 megabits per second) in the downlink and category 7 (11.5Mbps) in the uplink," according to Intel.
The multimode (LTE/3G/2G) platform XMM 7060 "is suitable for integration in LTE-enabled portable devices such as mobile handsets, data cards/dongles and other embedded solutions," Intel said.
The 3G silicon is shipping in volume now, while the LTE solution will be available for volume shipment in the second half of 2012. Though the world's largest manufacturer of chips, Intel will not be making these products, instead consigning production to an Asia-based manufacturer.