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Applied Materials signs Intel pact

Semiconductor manufacturing equipment maker Applied Materials announced on Tuesday that it has entered into a new multiyear software licensing agreement with Intel. Intel will license Applied's FAB300 Manufacturing Execution System, software that helps automate chipmaking, for use in manufacturing chips from 300-millimeter silicon wafers. The move to 300-millimeter wafers will help chipmakers increase their production capacity while lowering per-chip costs. Intel, which has already produced chips using 300-millimeter wafers, is expected to begin volume manufacturing with the technology early next year. Currently, most chips are manufactured using 200-millimeter wafers.

Semiconductor manufacturing equipment maker Applied Materials announced on Tuesday that it has entered into a new multiyear software licensing agreement with Intel. Intel will license Applied's FAB300 Manufacturing Execution System, software that helps automate chipmaking, for use in manufacturing chips from 300-millimeter silicon wafers.

The move to 300-millimeter wafers will help chipmakers increase their production capacity while lowering per-chip costs. Intel, which has already produced chips using 300-millimeter wafers, is expected to begin volume manufacturing with the technology early next year. Currently, most chips are manufactured using 200-millimeter wafers.