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Applied Materials signs Intel pact

Semiconductor manufacturing equipment maker Applied Materials announced on Tuesday that it has entered into a new multiyear software licensing agreement with Intel. Intel will license Applied's FAB300 Manufacturing Execution System, software that helps automate chipmaking, for use in manufacturing chips from 300-millimeter silicon wafers. The move to 300-millimeter wafers will help chipmakers increase their production capacity while lowering per-chip costs. Intel, which has already produced chips using 300-millimeter wafers, is expected to begin volume manufacturing with the technology early next year. Currently, most chips are manufactured using 200-millimeter wafers.

John G. Spooner Staff Writer, CNET News.com
John Spooner
covers the PC market, chips and automotive technology.
John G. Spooner
Semiconductor manufacturing equipment maker Applied Materials announced on Tuesday that it has entered into a new multiyear software licensing agreement with Intel. Intel will license Applied's FAB300 Manufacturing Execution System, software that helps automate chipmaking, for use in manufacturing chips from 300-millimeter silicon wafers.

The move to 300-millimeter wafers will help chipmakers increase their production capacity while lowering per-chip costs. Intel, which has already produced chips using 300-millimeter wafers, is expected to begin volume manufacturing with the technology early next year. Currently, most chips are manufactured using 200-millimeter wafers.