I'm in way over my head here swapping over a logic board on a Powerbook G4 17" 1.33, with the help of a guide at ifixit.com, ifixit has a thermal paste guide but I'm still not entirely sure on how it applies to this particular machine.
I've removed the faulty logic board and the replacement one is on standby - here's a photo of it; http://img810.imageshack.us/img810/3964/logicboard.jpg As you can see on the lower part of the image, bottom left corner there is the motorola processor, then next to that approx 1.5 inches square there is a heat sink(?) and then next to that there are 4 squares with a grey diamond shape in the centre - not quite sure what this is.
The latter two have a sort of white gunky foam residue which I'm in the process of removing with a spudger. The inside of the case where these components make contact have corresponding raised shapes, I was going to clean these with Artic clean's material remover and thermal surface remover.
Put simply then on the logic board there are two large squares and four small squares with a diamond in the middle, my questions are;
1. Should I use the Artic clean material remover and thermal surface purifier on all of these components.
2. Should I spread very thinly the ArticSilver 5 over each of these components?
Thanks in advance