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Intel's stacked with chipmaking options
March 9, 2006
Future multicore chips could be folded in half to improve the speed of signals moving around the chip.
TAGS:
multi-core processor
,
Intel
,
research
,
Intel Core Duo
,
technique
,
manufacturing
Quest for power control moves beyond the chip
February 7, 2006
Intel says reducing power consumed by PCs and servers will require advances in how all parts of a system manage and allocate voltage.
TAGS:
voltage
,
power consumption
,
cache memory
,
motherboard
,
transistor
,
manufacturing
,
Intel
,
CPU
,
technique
,
PC
TI sets out for 65 nanometers
March 22, 2004
Texas Instruments takes its first few steps toward a new generation of chip manufacturing technology and plans to start to producing processors with it in 2005.
TAGS:
Texas Instruments Inc.
,
nanometer
,
manufacturing process
,
transistor
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Sun UltraSPARC
,
SRAM
,
digital signal processor
,
wireless chip
,
manufacturing
,
power consumption
,
process
,
chip company
,
high-performance
,
Intel
,
technique
,
handheld
IBM, AMD further cut chip power consumption
December 6, 2005
At Washington conference next week, companies will outline strategies for enhancing processor performance.
TAGS:
transistor
,
AMD
,
power consumption
,
Silicon-on-Insulator
,
silicon
,
Semiconductor Manufacturing
,
manufacturing
,
semiconductor
,
AMD Opteron
,
technique
,
IBM Corp.
,
conference
,
Intel
,
process
IBM combo technique tweaks transistors
September 9, 2003
Researchers at Big Blue manage to combine strained silicon and a silicon insulator in the same wafer, a new approach that could lead to faster, more efficient chips in a few years.
TAGS:
transistor
,
silicon
,
wafer
,
layer
,
IBM Corp.
,
manufacturing
,
AMD Opteron
,
technique
,
researcher
,
approach
,
Intel
Sun: New chip can double performance
October 13, 2003
Sun Microsystems says its upcoming UltraSparc IV processor will outperform its predecessor by a factor of 1.6 to 2, providing more competition to Intel, IBM, AMD and others.
TAGS:
Sun UltraSPARC IV
,
Sun UltraSPARC
,
Sun UltraSPARC III
,
Sun Microsystems Inc.
,
Ingram Micro Inc.
,
Intel Itanium
,
Texas Instruments Inc.
,
circuitry
,
England
,
IBM Corp.
,
AMD
,
Intel Xeon
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Intel
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manufacturing
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vice president
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