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Content from CNET tagged with

Intel [x] , manufacturing [x] , technique [x]

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Showing 1-6 of 6 results found

Intel's stacked with chipmaking options

March 9, 2006 Future multicore chips could be folded in half to improve the speed of signals moving around the chip. TAGS: multi-core processor, Intel, research, Intel Core Duo, technique, manufacturing

Quest for power control moves beyond the chip

February 7, 2006 Intel says reducing power consumed by PCs and servers will require advances in how all parts of a system manage and allocate voltage. TAGS: voltage, power consumption, cache memory, motherboard, transistor, manufacturing, Intel, CPU, technique, PC

TI sets out for 65 nanometers

March 22, 2004 Texas Instruments takes its first few steps toward a new generation of chip manufacturing technology and plans to start to producing processors with it in 2005. TAGS: Texas Instruments Inc., nanometer, manufacturing process, transistor, Sun UltraSPARC, SRAM, digital signal processor, wireless chip, manufacturing, power consumption, process, chip company, high-performance, Intel, technique, handheld

IBM, AMD further cut chip power consumption

December 6, 2005 At Washington conference next week, companies will outline strategies for enhancing processor performance. TAGS: transistor, AMD, power consumption, Silicon-on-Insulator, silicon, Semiconductor Manufacturing, manufacturing, semiconductor, AMD Opteron, technique, IBM Corp., conference, Intel, process

IBM combo technique tweaks transistors

September 9, 2003 Researchers at Big Blue manage to combine strained silicon and a silicon insulator in the same wafer, a new approach that could lead to faster, more efficient chips in a few years. TAGS: transistor, silicon, wafer, layer, IBM Corp., manufacturing, AMD Opteron, technique, researcher, approach, Intel

Sun: New chip can double performance

October 13, 2003 Sun Microsystems says its upcoming UltraSparc IV processor will outperform its predecessor by a factor of 1.6 to 2, providing more competition to Intel, IBM, AMD and others. TAGS: Sun UltraSPARC IV, Sun UltraSPARC, Sun UltraSPARC III, Sun Microsystems Inc., Ingram Micro Inc., Intel Itanium, Texas Instruments Inc., circuitry, England, IBM Corp., AMD, Intel Xeon, Intel, manufacturing, technique, vice president
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