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Set prayer schedule with reminders and other features.
Organize your music collection by creating and editing file tags in bulk.
Update your CSV and TSV files, flat text, raw data, and variable-length binary files.
Generate, administer, archive, upload, export, and score tests.
Generates, archives, administers, scores, and prints tests.
Transform Oracle databases into TXT files.
Get an online ASP reservation system.
Simplify database reporting by reducing most operations to point-and-clicks and drag-and-drops.
View, edit, search & sort tabular data.
email extractor, filterer, verifier, manager, e-mailer
Big Blue's researchers have demonstrated fiber-optic technology that could help computers break through today's speed limits by transferring data faster.
IBM's so-called 3D-chip technology is set to be used in next-generation memory processors from Micron Technology, yielding very-high-speed DRAM.
Micron Technology tomorrow is set to unveil a type of hybrid memory that it claims will make standard memory chips used in PCs today 20 times faster.
Intel and others have been showing off "through-silicon vias," but IBM says it will come out with chips using the new technology next year. Photo: Closing in on TSV
Intel researches how to wed memory chips and processor cores, yielding impressive gains in speed and efficiency.
CEO Paul Otellini reveals plans at IDF to ship a "teraflop" processor around the end of decade with 80 cores.
Chipmaker plans to reveal a new way of opening up the data paths between processors, CNET News.com has learned.
Chipmaker gives developers a glimpse at its future, including dual-core chips, consumer flash memory and--Apple?
Chipmaker offers developers a peek at its future, including dual-core chips, consumer flash memory and--Apple?