Intel forum debuts to include USB 3.0 gear
A laptop and a video camera using the next-generation USB technology will make an appearance at the Intel Developer Forum next week.
As the next generation of Universal Serial Bus technology nears commercial reality, next week's Intel Developer Forum will play host to more USB 3.0-capable devices.
A Fujitsu laptop, a high-end video camera, and a solid-state drive using, among other hardware, will be demonstrated at IDF, according an announcement from the USB Implementers Forum on Thursday.
USB technology is now used on virtually all computing devices globally as well as the lion's share of consumer electronics products. Also referred to as "," next-generation USB 3.0 boosts the data transfer rate 10 times over current technology, while also improving power efficiency.
Consumer electronics devices enabled with USB 3.0 are expected in the market late this year or early next. The specification was developed by Intel, Hewlett-Packard, Microsoft, NEC, ST-Ericsson, and Texas Instruments.
On display at IDF, among other things, will be a Fujitsu laptop, the first to use built-in USB 3.0. Inside the Fujitsu laptop will be an NEC Electronics "host controller" chip that will exchange data with an external SuperSpeed USB drive from Buffalo Technology.
And USB 3.0 will be a godsend to video cameras--which often need to transfer gigabytes of video data. A prototype high-performance digital video camera from Point Grey Research will be rolled out that integrates a 3-megapixel Sony "IMX036" CMOS (complementary metal-oxide-semiconductor) image sensor to output 1080p high-definition images at 60 frames per second. This camera will stream uncompressed HD video to a laptop PC through a SuperSpeed USB ExpressCard from Fresco Logic.
Asus will also be present to show off its PC motherboard with SuperSpeed USB. The Asus X58 motherboard uses the same NEC chip and will exchange data with a LucidPort SuperSpeed USB mass storage device running the new USB Attached SCSI Protocol (UASP), which delivers improved performance and reduced latency.
The demonstrations will take place during two USB 3.0 technical sessions at IDF at the Moscone Center, San Francisco, starting on Tuesday.