IDF Shanghai preview: from Atom to Bloomfield to SSD
Intel hosts its semiannual developer forum. The event in China runs April 2 to 3.
The following is a partial list of the sessions at this week's Intel Developer Forum in China, which runs April 2 to 3. Topics set to be covered at IDF Shanghai include Netbook, Nettop, Bloomfield (Nehalem), solid-state drives, QuickAssist (accelerators), system-on-chip (Tolapai), and USB 3.0.
The items below are taken directly from Intel's own material:
Intel Atom Processor for the Desktop
The Essential Building Block for Purpose Built, Basic Desktop Computing Devices: Intel's strategy for basic desktop computing devices. See how the new Intel Atom processor based desktop platforms provide the world's best solution for basic computing, content consumption, and thin client.
Intel Basic Mobile Platform with Intel Atom Processor: Growing New Markets
Overview of growth opportunities for internet-centric computing devices or netbook market. Introduction to 2008 Basic Mobile Platform with Intel Atom Processor Architecture. Understand low cost system BOM (Bill Of Materials) & implications for netbooks. How netbooks are different from Mobile Internet devices, Ultra Mobile PCs, and Entry Notebooks. Opportunities for OEMs/ODM/Software community.
The Intel-Powered Classmate PC: Innovating for the Future
An introduction to technology for the next billion users and how to designing a product for first time user in environments that are not ideal. This includes the implementation of specific technical features in the Second and Next Generation Intel-powered classmate PC including: - PATA MLC Flash - Rugged and high temperature tolerant parts/design - Fan-less thermal system design.
Passive and Fanless Thermal Enabling for Affordable Internet-Centric Nettop
Introduction of Nettop, internet-centric computing devices roadmap and associated thermal solution space. Value proposition of passive/fanless cooling - Cost, Noise, new usage.
High End Desktop Platform, Next Generation (Nehalem) Processor
Background on the Desktop version of our Next Generation Intel Microarchitecture (Nehalem) Processor. Key electrical and system design guidelines to consider in designing a platform with the new Intel desktop processor (Bloomfield). Information on the new Quick Path Interconnect (QPI) & the Integrated Bus Controller on the new Intel desktop processor (Bloomfield) processor. Updates on other key new technologies of this High End Desktop platform and the advantages they bring to developers
Microsoft Windows Rally Technologies
The Windows Rally technologies provide manufacturers of network-connected devices with an architecture that enables effortless setup, more secure and manageable connectivity to other devices and computers, and rich end-user experiences. Using Windows Rally technologies enables hardware and software developers to focus development resources on product differentiation rather than connectivity fundamentals. For our mutual consumers, the result will be a dramatic reduction in complexity. Connecting a network device to a PC will be effortless, reliable, and more secure.
SATA Solid-State Drives: Not All Drives are Created Equal
A technical overview of NAND-based high-performance SATA solid-state drive (SSD) technology. A comparative review between Intel's upcoming SATA SSD products and other SSD and conventional hard disk drive alternatives, focusing on the areas of performance, power and reliability
DDR3, the Optimal Memory for Notebooks
Understand the benefits of DDR3 memory. Understand the DDR3 eco-system readiness and outlook for Mobile. Learn how memory impacts critical performance and power benchmarks and what these benchmarks mean to end-users.
Extreme Mobile Gaming: Design Considerations for High Performance Notebooks
Introduction to Extreme Edition Gaming Notebooks. Details on Extreme Edition Notebook hardware & software offerings. Updates on available Thermal technologies. Methods to tune platform performance
Inside Intel Next Generation Nehalem Microarchitecture
Intel's Nehalem microarchitecture is the next major microarchitecture update from Intel aligning to it's "Tick-Tock" cadence for processors. This session will provide architectural insight into this new microarchitecture that will start shipping in the second half of 2008. You will learn the details behind the key microarchitecture features including: Enhancements to the out of order execution engine. Enhancement to the Platform bandwidth. Enhancements to the cache subsystem. Extension to the instruction set with SSE4.2. And more...
Intel QuickAssist Technology Components
Understanding of the scope of Intel QuickAssist Acceleration Technology and Components. Hardware and software architecture of Intel QuickAssist Technology FSB-FPGA Accelerators and AAL. Learn about the Integrated Accelerator & Intel's new System On Chip Product (Tolapai). Hardware and software architecture framework of Tolapai
Moblin.org - Open Source Development for the Intel Powered Mobile Internet Device
Moblin.org, the umbrella open source project hosts the core software stack and technologies for Intel powered Mobile Internet Device (MID). This course will go into technical details on Moblin.org, for how you could setup platform-specific environment and build applications based on Moblin.org sub-projects and technologies.
SuperSpeed USB - Fast Sync-N-Go for Mobile Devices
SuperSpeed Market overview and Industry timeline updates. Update on SuperSpeed USB (USB 3.0) specification architecture details. Guidance on industry opportunities for 2008/2009
Intel Architecture Based SoC (System-on-Chip)
Join us to hear about the vision for Intel Architecture-based SoCs and the unique benefits that they bring to the industry. This Technology Insight will focus on a generic SoC on-die architecture and its impact on SoC-based platforms for embedded communications, mobile devices, and consumer electronics. The talk will also outline Intel's expectations of the industry ecosystem in the areas of Electronic System Level (ESL) language, tools, and new methodologies.