Broadcom is ramping up more chips designed to support 5G Wi-Fi, aka 802.11ac.
The chipmaker today announced its first 5G Wi-Fi combo chips designed specifically for entry-level consumer devices, meaning PCs, notebooks, tablets, and smartphones. Combo chips offer Wi-Fi, Bluetooth, and FM radio all in one package. This second generation of 5G Wi-Fi chips includes the same features as Broadcom's current lineup but integrates more components to keep costs down.
"This 1x1 design lowers cost while still delivering dramatic speed, power and performance, empowering a broad new user base to effortlessly stream HD video, and significantly increase … Read more
Former Apple and Palm executive Mike Bell has been picked by Intel to steer the company's newly-formed new devices division.
AllThingsD is reporting that Bell, previously the co-leader of Intel's mobile chip group, will be focusing on "ultra-mobile" products.
The move comes as part of a bigger internal Intel organizational juggling by the company's new CEO Brian Krzanich. Hermann Eul, Bell's co-leader of the mobile chip unit, will now be running the unit solo.
I am not sure how much intelligence it takes to pin a "Kick Me" sign on someone's back, but one imagines it doesn't befit Intel.
Perhaps that's why an employee of the company's New Mexico plant is suing in federal court, after someone allegedly pinned such a sign to his back and then more than one person actually kicked him.
The Associated Press reports that Harvey Palacio went to a senior member of staff named Randy Lehman to ask whether there was a sign on his back.
He claims in a lawsuit that Lehman … Read more
Intel needs to make waves in mobile computing. That's exactly what the first overhaul of the Atom chip design intends to do.
The new Silvermont Atom micro-architecture -- the first major architectural change since Atom debuted in 2008 -- delivers a "significant reduction in power [consumption] and a significant increase in performance," Dadi Perlmutter, an Intel executive vice president, said in a conference call Monday.
Perlmutter was quick to point out that the two -- performance and power efficiency -- are not incompatible. A slide (below) showed Silvermont Atom performing at twice the level of the previous … Read more
So you've had a couple of beers.
You meet a nice person of your target sex. Well, they seem nice, given that you've had a couple of beers.
At some point, one of you raises your beer cup to clink cups with the other.
The minute the cups clink, you are indelibly linked. At least you are if you're using Budweiser's special Facebook-friending cups.… Read more
Some models of Samsung's flagship smartphone, available globally in the coming weeks, will feature a quad-core processor from Qualcomm while others will feature Samsung's Exynos 5 chip with eight cores. The U.S. version will use the 1.9GHz Qualcomm Snapdragon 600 series chip.
Some in the tech press have criticized the lack of an eight-core chip in the U.S., but J.K. Shin, co-CEO of … Read more
Raja Koduri, who most recently served as director of graphics architecture for Apple, will be rejoining AMD four years after leaving that company, people familiar with the hire told CNET. He will be taking on a role in AMD's graphics business, though it wasn't immediately clear to CNET what his title would be. AMD is expected to make the announcement next week.
The move is the latest in a … Read more
Apple is cutting Samsung out of anything related to the chip slated for future iPhones and iPads, a South Korea-based newspaper reported.
Apple "has excluded its Korean rival from a project to develop A7...processors," wrote The Korea Times.
That chip will be the successor to the A6 and A6X -- which Samsung makes for Apple -- now powering the iPhone and iPad, respectively.
'"Apple is sharing confidential data for its next A7 system-on-chip (SoC) with the Taiwan Semiconductor Manufacturing Company (TSMC). TSMC has begun ordering its contractors to supply equipment to produce Apple's next processors,'' … Read more
Xerox has a different view on the future than most.
The company recently gave The New York Times the opportunity to see a new technology it's working on at its Palo Alto, Calif., research center. Referred to as Xerographic microassembly, the technology is based on the idea of laser printing and could one day become the most efficient way to bring circuitry to electronics products, Xerox claims.
According to the Times, Xerographic microassembly breaks traditional silicon wafers into thousands of "chiplets" and then bottles them up as a physical "ink." Once that ink is produced … Read more